Title X-ray Curing Epoxy Adhesive Systems
Source Proc. 48th Intl. SAMPE Symp. and Exhib.
Year 2003
Author(s) Hoyt Haight, A. E.; Harrah, L. A.; Sprouse, M. R.
Abstract X-ray curing adhesive systems offer significant potential for use in a variety of situations where heating is either difficult or undesirable. Such applications include aerospace repair, where difficult-to-reach areas and large penetration depths limit the utility of e-beam curing and detector assembly for high energy physics, where a room temperature cure is desired to minimize stresses. Adherent Technologies has been developing epoxy-based adhesive systems modified to promote x-ray initiated cure at relatively low doses. These systems contain a variety of fillers to increase the x-ray dose within the bond area. Several systems have been tested that exhibit neat resin cure at doses as low as 20kGy. Lap shear samples on G10 composite substrates have also been prepared and tested. Performance similar to e-beam cured cationic film adhesives was obtained.
Keywords Adhesives, Epoxy Resin, Radiation Processing, aerospace repair, x-ray cure

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