Publications
| Title | Thermal Expansion Model for Multiphase Electronic Packaging Materials |
|---|---|
| Source | Proc. MRS Symp. on Mechanical Behavior of Materials and Structures in Microelectronics |
| Year | 1991 |
| Author(s) | Allred, R. E.; Warren, W. E. |
| Abstract | |
| Keywords |
| Title | Thermal Expansion Model for Multiphase Electronic Packaging Materials |
|---|---|
| Source | Proc. MRS Symp. on Mechanical Behavior of Materials and Structures in Microelectronics |
| Year | 1991 |
| Author(s) | Allred, R. E.; Warren, W. E. |
| Abstract | |
| Keywords |